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KMID : 1102020160460030167
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Applied Microscopy
2016 Volume.46 No. 3 p.167 ~ p.169
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Cross-Sectional Transmission Electron Microscopy Sample Preparation of Soldering Joint Using Ultramicrotomy
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Bae Jee-Hwan
Kwon Ye-Na
Yang Cheol-Woong
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Abstract
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Solder/electroless nickel immersion gold (ENIG) joint sample which is comprised of dissimilar materials with different mechanical properties has limited the level of success in preparing thin samples for transmission electron microscopy (TEM). This short technical note reports the operation parameters for ultramicrotomy of solder joint sample and TEM analysis results. The solder joint sample was successfully sliced to 50~70 nm thick lamellae at slicing speed of 0.8~1.2 mm/s using a boat-type 45o diamond knife. Ultramicrotomy can be applied as a routine sample preparation technique for TEM analysis of solder joints.
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KEYWORD
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Sn-Ag solder, Electroless nickel immersion gold plating, Interfacial reaction layer, Ultramicrotomy, Transmission electron microscopy
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